ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

News Highlights New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and ...

AMD also is updating its workstation-level Ryzen AI Max+ mobile processors with two new models: the 12-core Ryzen AI Max+ 392 ...

Because ARM licenses its designs, multiple companies can integrate ARM technology into a single system-on-a-chip, or SoC. A modern smartphone SoC combines CPUs, graphics processors, AI accelerators, ...

Strategic brand consolidation aligns global computing innovation and technical support for next-gen Edge AI solutions amid demand for accelerated AI computing This strategic decision streamlines ...

Youyeetoo Company has introduced their latest Intel K1 computer-on-module board (COM), tailored for high-end embedded computing applications. Youyeetoo, a relatively lesser-known company in the ...

Forbes contributors publish independent expert analyses and insights. Fintech lawyer covering consumer finance, innovation and compliance. Happy entrepreneur uses a cellphone for online shopping and ...

Multivariate porous materials (MTV) are like a "collection of Lego blocks," allowing for customized design at a molecular level to freely create desired structures. Using these materials enables a ...

Modular computing solution providers Sundance Multiprocessor Technology (Sundance) and Etion Create have previewed a portfolio of embedded computing platforms that they will showcase at DSEI UK in ...

Introduction: The advancement of digitized material design has revolutionized the field of materials science by integrating computational modeling, machine learning, and high-throughput simulations.