Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

One of the key challenges with addressing the new devices on customers' NAND roadmap is that not only is there a significantly higher number of die per wafer, but the power per die and therefore power ...

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order ...

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...

Hermes-Epitek's semiconductor wafer testing solutions subsidiary, HTSI, will be listed on the over-the-counter (OTC) market on September 17, 2025. President Steven Wang stated that with artificial ...

Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated ramp of a ...