The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

One-shot devices, which are engineered for one-time use and are often subject to destructive testing, represent an important class of critical components in areas ranging from aerospace to biomedical ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Journal of Reliability Science and Engineering will be published by IOP Publishing and the Institute of Systems Engineering of China Academy of Engineering Physics Journal of Reliability Science and ...

ABERDEEN PROVING GROUND, Md. — Ensuring the reliability of military systems is a critical mission for the U.S. Army, and at the forefront of this effort is the U.S. Army Combat Capabilities ...

Tactile switches with advanced contact materials improve signal integrity, durability, and lifecycle performance in demanding ...

For more than half a century, oil analysis laboratories have been the backbone of industrial reliability programs. From ...