Radio Design Labs and its new majority owner Vopne Capital have named Erik Tarkiainen as RDL’s president. He succeeds company founder Joel Bump, who will remain with the business focused on product ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...