Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
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