Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...

PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

At the semicon west semiconductor equipment and materials trade show in San Francisco last month, competing announcements spelled potential trouble for companies in the fast-growing business of ...

PHOENIX, Arizona — Semiconductor polishing company Rodel Inc. has introduced a polishing pad for direct shallow trench isolation (STI) and pre-metal dielectric chemical mechanical planarization (CMP) ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company (DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...