Taiwan Semiconductor Manufacturing Co. (TSMC) this week debuted its first 0.35-micron BiCMOS process for wireless and communications applications. TSMC (nyse: TSM), based in Hsinchu, Taiwan, said it ...

X-Fab Semiconductor Foundries AG today said it is expanding its existing 0.6-micron BiCMOS process, called XB06. Erfurt, Germany-based X-Fab said it would increase the number of available process ...

In an effort to gain a competitive edge in the cost-sensitive wireless communications arena, STMicroelectronics has added silicon-germanium (SiGe) biCMOS to its arsenal of process technologies. The ...

Scientists from imec’s IDLab demonstrated a 120-Gbaud transmitter IC that implements a SiGe BiCMOS multiplexer, equalizer, and driver. The architecture significantly increases baud rate and has a high ...